• Semiconductor, Components, Substrates, and Sub-Assemblies Ultrasonic Cleaner Jp-040s

Semiconductor, Components, Substrates, and Sub-Assemblies Ultrasonic Cleaner Jp-040s

Feature: Cavitation
Certification: RoHS, CE
Condition: New
Customized: Non-Customized
Power Supply: 110~240V
Ultrasonic Frequency: 40kHz
Customization:
Diamond Member Since 2013

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Basic Info.

Model NO.
JP-040S
Timer
1-30 Minutes
Temperature
20-80 C
Fuel
Electric
Cleaning Process
Solvent Cleaning
Tank Size
300*240*150mm
Transport Package
Carton Box
Specification
CE, ROHS
Trademark
skymen
Origin
Guangdong, China
HS Code
845620
Production Capacity
5000PCS/Month

Product Description

Semiconductor, components, substrates, and sub-assemblies ultrasonic cleaner JP-040s

Semiconductor, Components, Substrates, and Sub-Assemblies Ultrasonic Cleaner Jp-040s

Semiconductor, Components, Substrates, and Sub-Assemblies Ultrasonic Cleaner Jp-040s
 
Ultrasonic  mode Ultrasonic  Frequency     40, 000  Hz
Material     Stainless  Steel  SUS304
Tank  Capacity     10 L
Timer     1-30 minutes  , digital timer
Heater     20° C  to  80° C
Power  Supply AC  100  ~  120V,   50  /  60Hz
AC  220  ~  240V,   50  /  60  Hz
Ultrasonic  Power 240 W
Heating  Power 300 W
Packing Unit  Size 300*240*150  mm  (  L  x  W  x  H  )
Tank  Size 380x 270 x  280 mm  (  L  x  W  x  H  )
Package  Size 48*38*38 (  L  x  W  x  H  )
N. W. 7.5 kg
G. W. 8.4 kg

Fast and effective cleaning with no manual labor:
Thoroughly removes blood, saliva, dirt, and other debris
Ultrasonic metal finishing aggressively removes solid materials from metal surfaces without damage. An absolutely clean substrate is critical for electroplating, electrophoretic coating, or powder coating. Whether applying organic coatings or metal deposits, a high quality finished product can be ensured by ultrasonic pre-treatment cleaning.



Ultrasonic Cleaning:
Ultrasonic cleaning is a method based on high-frequency sound waves which when traveling into a solution,
Create oscillating high and low pressure and consequently, cause the rapid formation and imploding bubbles radiate tremendous amounts of ultrasonic energy and shock waves that penetrate into minute crevices to take off dirts or contaminants in a highly effective way.

Ultrasonic metal finishing aggressively removes solid materials from metal surfaces without damage. An absolutely clean substrate is critical for electroplating, electrophoretic coating, or powder coating. Whether applying organic coatings or metal deposits, a high quality finished product can be ensured by ultrasonic pre-treatment cleaning.


Before and after:
Semiconductor, Components, Substrates, and Sub-Assemblies Ultrasonic Cleaner Jp-040s
Semiconductor, Components, Substrates, and Sub-Assemblies Ultrasonic Cleaner Jp-040s

Semiconductor, Components, Substrates, and Sub-Assemblies Ultrasonic Cleaner Jp-040s

Applications:
Industry: Switches, Gears, Nozzles, Relays and motors, Bearings, Sieves,
Metal, Ironware and plastic parts
Medical and Dental Labs: Hypodermic needles, Cannulae, Surgical
Instruments, Blood oxygenators, Dental instruments, Dentures, Plates
Scientific Labs: Laboratory glassware, Test tubes, Pipettes, Optical and
Contact lenses, Eyeglass frames, Components
Jewelry: Watches, Clock movements, Gemstones, Pendants, Chains
Electronics: Printed circuit boards, Lapping heads, Capacitors, Packaging
Components, Quartz crystals
Chemical Experiments: Degassing of soution, Dissolution of powdered sample

 

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